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http://hdl.handle.net/10119/12088
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Title: | Building high-accuracy thermal simulation for evaluation of thermal comfort in real houses |
Authors: | Nguyen, Hoaison Makino, Yoshiki Lim, Azman Osman Tan, Yasuo Shinoda, Yoichi |
Keywords: | thermal environment smart house simulation |
Issue Date: | 2013 |
Publisher: | Springer |
Magazine name: | Lecture Notes in Computer Science |
Volume: | 7910 |
Start page: | 159 |
End page: | 166 |
DOI: | 10.1007/978-3-642-39470-6_20 |
Abstract: | Thermal comfort is an essential aspect for the control and verification of many smart home services. In this research, we design and implement simulation which models thermal environment of a smart house testbed. Our simulation can be used to evaluate thermal comfort in various conditions of home environment. In order to increase the accuracy of the simulation, we measure thermal-related parameters of the house such as temperature, humidity, solar radiation by the use of sensors and perform parameter identification to estimate uncertain parameters in our thermal model. We also implement a communication interface which allows our simulator to communicate with other external simulators. Experimental result showed that our simulation can achieve high accuracy when compared with actual measurement data. |
Rights: | This is the author-created version of Springer, Hoaison Nguyen, Yoshiki Makino, Azman Osman Lim, Yasuo Tan, and Yoichi Shinoda, Lecture Notes in Computer Science, 7910, 2013, 159-166. The original publication is available at www.springerlink.com, http://dx.doi.org/10.1007/978-3-642-39470-6_20 |
URI: | http://hdl.handle.net/10119/12088 |
Material Type: | author |
Appears in Collections: | b10-1. 雑誌掲載論文 (Journal Articles)
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