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Please use this identifier to cite or link to this item: http://hdl.handle.net/10119/9834

Title: Low Resistivity Metal Lines Formed by Functional Liquids and Successive Treatment of Catalytically Generated Hydrogen Atoms in Cat-CVD System
Authors: Kieu, Nguyen Thi Thanh
Ohdaira, Keisuke
Shimoda, Tatsuya
Matsumura, Hideki
Keywords: Hydrogen treatment
Functional liquid
Metal line
Issue Date: 2011
Publisher: Elsevier
Magazine name: Thin Solid Films
Volume: 519
Number: 14
Start page: 4565
End page: 4567
DOI: 10.1016/j.tsf.2011.01.303
Abstract: Metal-interconnection amang electrdes is an inportant process to fabricate electronic devices. A novel high-speed technique using silver(Ag) functional loquid to form Ag lines is proposed. For improvement of eletrical conductivity of the Ag lines, Tomic hydrogen(H) generated by Cat-CVD system is used. There is a sintering phenomenon amang Ag nanoparticles(~50nm) duirng H treatment at low substrate temperatures(~100C). Scanning electron microscopy(SEM) reveals that the Ag grain size increases with H annealing duration, which results in the resistivity of the Ag lines on the order of 10^<-6> Ω cm.
Rights: NOTICE: This is the author's version of a work accepted for publication by Elsevier. Nguyen Thi Thanh Kieu, Keisuke Ohdaira, Tatsuya Shimoda, and Hideki Matsumura, Thin Solid Films , 519(14), 2011, 4565-4567, http://dx.doi.org/10.1016/j.tsf.2011.01.303
URI: http://hdl.handle.net/10119/9834
Material Type: author
Appears in Collections:c10-1. 雑誌掲載論文 (Journal Articles)

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