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Please use this identifier to cite or link to this item: http://hdl.handle.net/10119/10283

Title: Design Optimization of One-Time-Use Leaping Mechanism for Sensor Node Relocation
Authors: Lee, Gabseong
Lee, Geunho
Nishimura, Yasuhiro
Chong, Nak Young
Choi, Dong-Hoon
Keywords: design automation
process integration and design optimization
sensor node mobility
leaping mechanism
Issue Date: 2011-08-24
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Magazine name: 2011 IEEE Conference on Automation Science and Engineering (CASE)
Start page: 749
End page: 754
DOI: 10.1109/CASE.2011.6042419
Abstract: This paper proposes a design automation method to optimize one-time-use leaping mechanism for relocating energy-constrained sensor nodes. The leaping mechanism is expected to enhance coverage and connectivity of sensor networks initially randomly deployed with minimum energy consumed. Of particular interest is proper relocation of isolatednodes under uncertain environment conditions. Specifically, we consider how the aerodynamic disturbance can be minimizedwith an optimized launch angle of the leaping mechanism. Toconstruct an automated simulation and design environment, the process integration and design optimization (PIDO) approach is employed. We not only obtain an optimum solution satisfying all imposed requirements, but also demonstrate an automated design process for controlled node mobility.
Rights: Copyright (C) 2011 IEEE. Reprinted from 2011 IEEE Conference on Automation Science and Engineering (CASE), 2011, 749-754. This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of JAIST's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
URI: http://hdl.handle.net/10119/10283
Material Type: author
Appears in Collections:a11-1. 会議発表論文 (Conference Papers)

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