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Please use this identifier to cite or link to this item: http://hdl.handle.net/10119/12088

Title: Building high-accuracy thermal simulation for evaluation of thermal comfort in real houses
Authors: Nguyen, Hoaison
Makino, Yoshiki
Lim, Azman Osman
Tan, Yasuo
Shinoda, Yoichi
Keywords: thermal environment
smart house
simulation
Issue Date: 2013
Publisher: Springer
Magazine name: Lecture Notes in Computer Science
Volume: 7910
Start page: 159
End page: 166
DOI: 10.1007/978-3-642-39470-6_20
Abstract: Thermal comfort is an essential aspect for the control and verification of many smart home services. In this research, we design and implement simulation which models thermal environment of a smart house testbed. Our simulation can be used to evaluate thermal comfort in various conditions of home environment. In order to increase the accuracy of the simulation, we measure thermal-related parameters of the house such as temperature, humidity, solar radiation by the use of sensors and perform parameter identification to estimate uncertain parameters in our thermal model. We also implement a communication interface which allows our simulator to communicate with other external simulators. Experimental result showed that our simulation can achieve high accuracy when compared with actual measurement data.
Rights: This is the author-created version of Springer, Hoaison Nguyen, Yoshiki Makino, Azman Osman Lim, Yasuo Tan, and Yoichi Shinoda, Lecture Notes in Computer Science, 7910, 2013, 159-166. The original publication is available at www.springerlink.com, http://dx.doi.org/10.1007/978-3-642-39470-6_20
URI: http://hdl.handle.net/10119/12088
Material Type: author
Appears in Collections:b10-1. 雑誌掲載論文 (Journal Articles)

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