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Please use this identifier to cite or link to this item: http://hdl.handle.net/10119/13834

Title: The control of the film stress of Cat-CVD a-Si films and its impact on explosive crystallization induced by flash lamp annealing
Authors: Ohdaira, Keisuke
Keywords: flash lamp annealing
amorphous silicon
polycrystalline silicon
film stress
explosive crystallization
Issue Date: 2015-01-30
Publisher: Elsevier
Magazine name: Thin Solid Films
Volume: 575
Start page: 21
End page: 24
DOI: 10.1016/j.tsf.2014.10.018
Abstract: Catalytic chemical vapor deposition (Cat-CVD) can produce amorphous silicon (a-Si) films with low film stress, in general, compared to plasma-enhanced CVD, and is thus suited for the preparation of precursor a-Si films for thick poly-Si films applied for solar cells. The stress of a-Si films is known to sometimes play an important role for the crystallization of a-Si films and resulting grain size of polycrystalline Si (poly-Si) films formed. I investigate the impact of the stress of Cat-CVD a-Si films on the mechanism of explosive crystallization (EC) induced by flash lamp annealing (FLA). The stress of Cat-CVD a-Si films can be controlled by changing the temperatures of substrates and/or a catalyzing wire during film deposition. Cat-CVD a-Si films with tensile stress (~ 200 MPa) can be deposited as well as films with compressive stress. The enlargement of grain size is observed in a part of flash-lamp-crystallized (FLC) poly-Si films formed from Cat-CVD films with tensile stress compared to those with compressive stress, which might be an indication of a certain degree of impact of film stress on poly-Si formation. The grain size is, however, much smaller than that of FLC poly-Si films formed from electron-beam- (EB-) evaporated a-Si films with similar tensile stress. This fact may indicate the existence of other critical determinant of EC mechanism.
Rights: Copyright (C)2014, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International license (CC BY-NC-ND 4.0). [http://creativecommons.org/licenses/by-nc-nd/4.0/] NOTICE: This is the author's version of a work accepted for publication by Elsevier. Keisuke Ohdaira, Thin Solid Films, 575, 2014, 21-24, http://dx.doi.org/10.1016/j.tsf.2014.10.018
URI: http://hdl.handle.net/10119/13834
Material Type: author
Appears in Collections:z8-10-1. 雑誌掲載論文 (Journal Articles)

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